JR56711 FE CPIE RDA Defect Engineering Snr Engineer/Principal Engineer
As an Central Team Process Integration Engineering Real-Time Defect Analysis Defect Engineering Engineer at Micron Technology, Inc., you will be responsible for facilitating improvement of manufacturing capability, executing global business processes, and enabling the leverage of world-wide resources to deliver industry benchmark methods at the lowest costs in your unit process area(s) of responsibility.
One of your main role is to drive HBM (High Bandwidth Memory) defectivity improvement for BIC (best in class) defect performance.
Your objective is to drive global peer groups to align and optimize manufacturing performance. Execute to this by focusing on manufacturing big rock performance gaps (metrics) and leverage the global network to define solutions that can be driven across all sites. You will work with your customers on benchmarking these metrics to improve performance in the network. Examples include equipment and process safety best known methods (BKM), yield and quality improvements, equipment utilization optimization, wafer thru-put optimization, cash cost spend optimization, and continuous improvement project prioritization and execution to project timelines.
This position requires interfacing with Key Equipment Groups, R and D, and Procurement, as well as interaction with equipment and materials suppliers to drive area manufacturing issues forward. You must be willing and capable of effective collaboration with manufacturing sites, R and D, Procurement, Quality Engineering, other Central Team departments, and external suppliers to accomplish your objectives. You must also be willing and capable of international travel, as needed, to accomplish your objectives.