What you will be working on
· Lead and develop a team of process development engineers focused on high thermal conductivity thin films for advanced packaging and HPC applications, fostering innovation, technical excellence, and collaboration
· Own the roadmap to develop thermal films or materials aligned to customer performance and integration requirements.
· Leverage ASM’s ALD/PEALD, CVD/PECVD, and surface preparation expertise to design, optimize, and qualify high thermal conductivity materials and stacks for use in advanced devices and packages.
· Drive high thermal conductivity thin film development, including process optimization for deposition rate, uniformity, materials properties, morphology and bondability.
· Define, influence, and drive new hardware requirements and development in close collaboration with hardware and software engineering teams to meet advanced on high thermal conductivity process specifications and integration schemes.
· Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies.
· Partner with corporate and global R&D organizations to deliver new materials, surface preparation schemes, and applications that support critical technology inflections in thermal management and advanced packaging.
· Ensure generation and protection of intellectual property and technical publications.
· Stay at the forefront of state-of-the-art semiconductor processing and thermal management technologies, maintaining strong technical communication with industry peers and key customers.
· Communicate at a highly technical level with end customers to build trust in ASM’s ability to solve their most advanced thermal and device challenges.