Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
The Marvell - Central Engineering Packaging organization drives semiconductor IC package development from concept to mass production and is responsible for supporting customers with advanced custom package designs that meet challenging electrical requirements. Many of the new designs are requiring multi-chip and multiple component configurations driving advanced technology requirements. There is the excitement of always working on new projects and cutting-edge technologies.
Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond.
What You Can Expect
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You will be responsible for package electrical design, modeling, and characterization of high speed signals channel, focusing on signal integrity optimization while considering manufacturing and assembly tolerances.
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You will also interface with package layout design team, ensure manufacturability, and compliance with performance, reliability, and cost requirements.
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You will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
What We’re Looking For
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Bachelor’s degree in Electrical Engineering with 1+ years of related professional experience
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Strong fundamentals in electrical circuits theory, electromagnetics (EM), transmission lines and microwave theory, Signal and Power Integrity.
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Experience in using 2-D and 3-D electromagnetic simulation tools such as Ansys HFSS/SIWave, Cadence Clarity /PowerDC / PowerSI / XtractIM, Keysight ADS circuit simulation.
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Frequency domain and time domain knowledge of high speed signaling.
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Experience with channel simulations using MATLAB, ADS or other tools.
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Power plane design, modeling and analysis for Power Integrity.
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Familiarity with IC package or PCB layout tools like Cadence APD, Mentor PADS, Xpedition Package Designer.
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Experience with 2.5D/3D package development is desirable.
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Working knowledge of circuit design tools (e.g. Spectre, ADS, HSpice, Ansys Electronics Desktop Circuit Design).
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Familiarity with packaging technologies, materials, package substrate design rules and assembly rules.
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Must have strong teamwork skills, as well as strong communication, presentation, and documentation skills.
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Good English knowledge both verbal and written.
Expected Base Pay Range
120,300 - 160,400, RON per annum
The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.