· Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field
· Strong semiconductor reliability experience across silicon, BEOL, interconnect or advanced package technologies
· Deep understanding of mechanisms such as EM, TDDB, BTI and HCI
· Hands-on experience with HTOL, thermal cycling, thermal shock, reflow testing and JEDEC reliability standards
· Ability to use X-ray and CSAM analysis to diagnose package defects and support root-cause analysis
· Strong technical judgement, communication skills and ownership across foundries, OSATs, labs and internal teams