• 10+ years of working experience in transceiver assembly process development or similar products, with in-depth knowledge in material (solder, epoxy, glass, ceramic, etc.), equipment (SMT, die bonder, active aligner, TCB bonding, etc.), component (FR4, PIC chip, EIC chip, FAU, SMD, etc.). Must be very familiar with the typical process capabilities.
• Familiar with FMEA, Control Plan, SPC, 8D, etc.