Project Description
The Wafer Intelligent Scanner collects inspection data from the edge, or bevel, of wafers during semiconductor manufacturing. This internship project uses data analytics to study Wafer Intelligent Scanner metrics, identify patterns linked to defects, and determine early warning indicators that may help prevent future yield issues.
The goal is to transform large volumes of inspection data into actionable insights that enable engineers to detect potential issues earlier and reduce wafer defects. The intern will gain practical exposure to semiconductor process and equipment engineering, defect analysis, machine learning, and AI-Enabled manufacturing analytics.