► Development of AIT (assembly and interconnection technologies) for PCB (Printed Circuit Board) based electronic control units,
► Definition of solder joint load capability,
► Material characterization and lifetime description of AIT in electronic control units,
► Setting up and evaluating experiments,
► Creating reports in English and presenting them to project teams,
► Usage of big data methods to increase development efficiency,
► Work in cross-functional simultaneous engineering teams, with product development teams, both locally and internationally,
► Technical coordination of reliability related activities (simulations, tests, analyses),
► Agreement of project targets with customer and regular reporting of project status to customer and management,
► Apply project management tools, like quality management, change management, risk management to ensure project success.