Key Responsibilities
• Prepare TEM samples using Dual Beam FIB/PFIB and related techniques for site-specific analysis
• Operate lab tools including SEM, FIB/PFIB, and optical imaging systems for material analysis and sample prep
• Perform wafer handling, coating, and pre-treatment processes to support TEM workflows
• Execute sample fabrication steps based on schematics, layouts, and engineering instructions
• Partner with engineers and analysts to ensure samples meet quality and turnaround expectations
• Support lab sustaining activities including safety, tool maintenance, and process documentation
• Participate in process improvements, BKM development, and cross-training on new techniques
• Maintain accurate documentation and follow standard operating procedures
Your responsibilities will include but not be limited to:
• Operate lab instruments to support high volume manufacturing of advanced technology nodes:
o Hands on handling Silicon Wafer/pieces.
o Operates lab tools, such as sputter coaters and spin coaters for sample pre-treatment.
o Operates Dual Beam FIB/PFIB to perform site-specific cross sectioning and prepare TEM samples, including site marking, depositing protective materials, de-layering, imaging and TEM lamella preparation.
o Operates SEM for imaging and material analysis.
• Works from schematics, diagrams, written and verbal descriptions, layouts or plans to perform moderately complex sample fabrication procedures.
• Participate in safety forums, lab sustaining and development, process transfer, tool ownership, BKM development, and cross training on other techniques.
• Willing to work compressed shift with 12hr shift.
• Ability to lift and carry up to 50 lb.
• Long time standing and walking occasionally.