• Lead matrixed teams across design, fab, assembly, test, quality, and operations to define and execute the product Plan of Record (POR).
• Drive end-to-end development of Photonic ICs (PICs), Electronic ICs (EICs), and manufacturing process technologies from concept through production ramp.
• Balance technical tradeoffs, business priorities, cost, schedule, and risk to enable informed decision-making and successful product execution.
• Identify and mitigate technical and execution risks through contingency planning and cross-functional alignment.
• Drive manufacturing readiness, including wafer-start planning, qualification strategy, capacity analysis, customer sampling, and assembly/test site certification.
• Serve as the primary interface to stakeholders and leadership, providing clear communication of product status, risks, and recommendations.
• Build strong partnerships across organizations to accelerate execution and deliver business results.
• Interface with fab, optical design, hardware, firmware, IC design, test, operations, and quality teams to ensure successful product development and manufacturing ramp.