You will join the Integrated Photonics team in Massy, composed of senior engineers, PhDs, and research interns working across design, characterization, and packaging of our PICs.
The team owns the full design cycle of our photonic circuits — from simulation and layout to foundry collaboration and performance feedback. Fabrication is outsourced, but simulation depth, architectural choices, and design-for-manufacturing decisions are fully internal.
You will design and optimize key building blocks of our PIC platform, translating system requirements into robust and manufacturable layouts that support the evolution of our processors. Working closely with characterization, you will iteratively refine your designs based on fabrication variability and experimental feedback.
The coming year is strongly design-driven, with a focus on improving robustness against fabrication variability, increasing integration density, and preparing architectural evolutions for future scalable quantum processors.
What you design today directly shapes the scalability, stability, and performance of tomorrow’s photonic quantum processors.
Your work directly impacts how efficiently our circuits scale, how resilient they remain under fabrication variability, and how quickly research concepts become reliable hardware.
As Quandela grows, this role helps shape not only components, but also the design methodologies and standards that will support larger-scale and fault-tolerant quantum architectures.