Lead the design and development of new MOSFET packages, especially for lead frame based (e.g. DFN).
•
Lead frame and clip frame design experience is preferred.
•
Create detailed package models using 3D CAD software and define all critical dimensions, material stack-ups, and assembly drawings.
•
Optimize package designs for superior electrical performance (low RDS(on), low parasitic inductance/capacitance), thermal performance (low RthJC), and mechanical robustness.
•
Simulation & Analysis:
•
Perform multi-physics simulations, including thermal (e.g., Ansys Icepak, SolidWorks Simulation), electrical (e.g., Q3D Extractor, HFSS), and mechanical stress analysis to predict and validate package performance.
•
Analyze simulation results to identify design trade-offs and drive design improvements.
•
Correlate simulation models with empirical data from lab characterization to ensure accuracy.
•
Material Selection & Qualification:
•
Evaluate and select packaging materials, including leadframes, mold compounds, die-attach materials, and bonding wires, to optimize performance, reliability, and cost.
•
Work with suppliers to qualify new materials and processes.
•
Cross-Functional Collaboration:
•
Collaborate closely with silicon design, test engineering, product engineering, and reliability teams to ensure package designs meet all product specifications.
•
Partner with PE and EE to develop robust manufacturing processes, troubleshoot yield issues, and ensure smooth new product introductions.
•
Interface with application engineers to understand customer requirements and translate them into package design criteria.
•
Documentation & Process Improvement:
•
Maintain comprehensive design documentation, including specifications, simulation reports, and assembly procedures.
•
Contribute to the development of internal design rules, guidelines, and best practices for package engineering.
•
Stay current with industry trends, emerging packaging technologies, and competitive landscape.
Required Qualifications
•
Education: Bachelor of Science (B.S.) in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field. A Master of Science (M.S.) is highly preferred.
•
Experience:
•
5+ years of direct experience in semiconductor package development, with a strong focus on power devices (MOSFETs or IGBTs).
•
Proven track record of successfully taking packages from concept through design, simulation, and high-volume manufacturing.
•
Technical Skills:
•
Proficiency in 3D CAD software (e.g., AutoCAD, SolidWorks, Creo).
•
Strong understanding of semiconductor packaging processes, including die attach, wire bonding, and molding.
•
Deep knowledge of power semiconductor physics, including thermal management, parasitics, and failure mechanisms.
•
Familiarity with reliability testing standards and methodologies (e.g., JEDEC, AEC-Q101) for automotive and industrial applications.
Come join our global, inclusive & diverse team
Our purpose is to improve the quality of life of everyone we touch through our innovative motion systems. We are a truly global team bound together by our shared values. Our culture is built on the diversity, knowledge, skills, creativity, and talents that each employee brings to the company. Our people are our company’s most valuable asset. We are committed to providing an inclusive, diverse and equitable workplace where employees of different backgrounds feel valued and respected, regardless of their age, gender, race, ethnicity or religious background. We are committed to inspiring our employees to grow, act with ownership and find fulfilment and meaning in the work they do.