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Process Engineer

LocationBangkok

Typefull-time

Company size10,000+ people

First seen3d ago

Last seen1d ago

Job Summary:

Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Backgrind, or DBG processes.

Job Responsibility

Responsibilities

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Define/optimize procedures to ensure smooth processing of production lots

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Develop and maintain process documentation and SOPs including operator training

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Lead root cause analysis for defects and yield losses

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Provide disposition on lots with quality issues

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Support new product introduction and process qualification

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Analyze production data to identify process improvements

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Collaborate with cross-functional teams on cost reduction and process improvement projects

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Perform change management including new material qualification

Qualification

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Bachelor’s or master’s degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).

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3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.

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Strong data analysis and problem-solving skills.

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Experience with Statistical Process Control (SPC) and process validation (preferred).

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With good command of English language.

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Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).

More information about NXP in Thailand…

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