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GoogleStaff Semiconductor Thin Films Process Engineer, Raxium
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Before you apply
Salary$188k – $274k
LocationFremont, CA, USA
Work modeon-site
Typefull-time
SeniorityLead
Experience5+ yrs
EquityIncluded
Company size10,000+ people
PostedOct 22, 2026 · 1w ago
Verified live2d ago
At a glanceSummarised by Seekless from the posting.
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
5 years of experience in the semiconductor industry maintaining equipment, such as ICP, PVD, or CVD.
Experience with conventional microfabrication techniques, including lithography, etch, thin-film deposition, and metrology.
Experience with data analysis and reporting.
Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field.
Experience in data analysis in quality reliability (tools like JMP).
Experience with microdisplay or microLED technology.
Understanding of statistical process control and process improvement, including implementation experience.
Skills
ICP
PVD
CVD
JMP
sputtering
PECVD
e-beam
Benefits
Equity
About the company
Google’s Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.Individual pay is determined by factors including job-related skills, experience, and relevant education or training.
Benefits
US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits
Learn more about benefits at Google.
Responsibilities
•
Develop and sustain new processes associated with thin film deposition tools including sputtering, PECVD, e-beam, PVD, and others.
•
Manage process control and defectivity reduction to deliver yield improvements.
•
Work with the Process Engineering team to select our next-generation of tools needed for volume manufacturing.
•
Collaborate with the Integration team to develop new process capabilities that address new design requirements.
Minimum qualifications:
•
Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
•
5 years of experience in the semiconductor industry maintaining equipment, such as ICP, PVD, or CVD.
•
Experience with conventional microfabrication techniques, including lithography, etch, thin-film deposition, and metrology.
•
Experience with data analysis and reporting.
Preferred qualifications:
•
Master’s degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
•
Experience in data analysis in quality reliability (tools like JMP).
•
Experience with microdisplay or microLED technology.
•
Understanding of statistical process control and process improvement, including implementation experience.