Skip to content

Manufacturing Technical Program Manager

Read straight from AttoTude's careers page, verified 2d ago.Seekless can tailor your résumé to it.
Seekless can write your résumé for this posting first.
Before you apply
Salary$150k – $220k
LocationMenlo Park, California, Menlo Park, CA
Typefull-time
SenioritySenior
Experience8+ yrs
DepartmentSupply Chain
Company size51–200 people
PostedJan 30, 2026 · 9mo ago
Verified live2d ago
May no longer be actively hiring
Posted by the company on Jan 30, 202656% of this company's open roles have been listed for 90+ days
How we check a job is still live
At a glanceSummarised by Seekless from the posting.
Bachelor's degree in Engineering or related discipline
8+ years of experience in technology development, wafer fabrication, or advanced manufacturing NPI
Proven experience leading wafer-level or semiconductor-based products through production ramp
Ability to manage complex technical programs across multiple teams, sites, and manufacturing partners
Experience working directly with wafer fabs, OSATs, and external manufacturing partners
Hands-on experience with silicon wafer fab processes (lithography, etch, deposition, CMP, metrology)
Experience with advanced packaging or interposers
Familiarity with high-performance interconnects (wires, cables, connectors)
Experience supporting datacenter, HPC, or performance-critical hardware
Equal opportunity employer statement
About AttoTude, The World’s First THz Radio Over Wire
AttoTude is at the forefront of revolutionizing data centers through advanced interconnect technology based on wired THz transceivers. By adapting the fiber from photonics and advancing today’s ASICs to THz, our innovative AttoEngine eliminates networking bottlenecks, enabling high-speed interconnects for AI data centers.
Job Summary
The Manufacturing Technical Program Manager (MFG TPM) leads the development, industrialization, and execution of advanced manufacturing technologies spanning wafer fabrication, innovative wire solutions, and precision alignment/assembly processes. The role owns technical program strategy, readiness milestones, and execution cadence to mature new technologies from early development through high-volume production.
Serving as a technical bridge across R&D, wafer fabs, OSATs, Manufacturing Engineering, and CMs, the MFG TPM ensures alignment between design intent, process capability, yield, and manufacturing readiness across globally distributed teams. The role combines strong wafer-fab technical understanding with disciplined program leadership and hands-on problem solving to support advanced datacenter hardware platforms.
Key Responsibilities
•
Own end-to-end technical execution of NPI programs from technology development through production ramp.
•
Drive concurrent development with R&D, aligning device architecture, process flows, and manufacturing strategy.
•
Lead wafer fabrication industrialization, including lithography, deposition, etch, CMP, metrology, and yield ramp.
•
Define and manage technology readiness milestones, build gates, and technical risk mitigation.
•
Act as the primary technical integrator and escalation point across fabs, OSATs, Manufacturing Engineering, and CMs.
•
Transition technologies from pilot builds into high-volume fab and manufacturing environments.
•
Establish yield learning, SPC, and control strategies and lead root cause resolution for process and reliability issues.
•
Own technical change control and ensure clear, consistent communication across sites and partners.
Required Qualifications
•
Bachelor’s degree in Engineering or related discipline (Master’s preferred).
•
8+ years of experience in technology development, wafer fabrication, or advanced manufacturing NPI.
•
Proven experience leading wafer-level or semiconductor-based products through production ramp.
•
Ability to manage complex technical programs across multiple teams, sites, and manufacturing partners.
•
Experience working directly with wafer fabs, OSATs, and external manufacturing partners.
Preferred Qualifications
•
Hands-on experience with silicon wafer fab processes (lithography, etch, deposition, CMP, metrology).
•
Experience with advanced packaging or interposers.
•
Familiarity with high-performance interconnects (wires, cables, connectors).
•
Experience supporting datacenter, HPC, or performance-critical hardware.
Key Competencies
•
Technology development and industrialization
•
Wafer fab and process integration
•
Technical program ownership
•
Cross-functional and cross-site communication
•
Yield, reliability, and manufacturability optimization
Legal
AttoTude is an equal opportunity employer. We’re committed to building a diverse and inclusive workplace and providing equal employment opportunities to all applicants and employees. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity or expression, national origin, age, disability, veteran status, or any other legally protected characteristic.
Annual Salary Range
$150,000—$220,000 USD