Director, Advanced Power Silicon & Packaging Technology
LocationShanghai (JingAn)
Typefull-time
SeniorityDirector
Experience15+ yrs
Company size10,000+ people
First seenOct 10, 2026 · 1d ago
Verified live1d ago
At a glanceSummarised by Seekless from the posting.
Must have14
BS in Electrical Engineering, Physics, Materials Science, or related discipline
15+ years of semiconductor and power technology experience
6+ years leading technology, architecture, or engineering organizations
Proven success delivering innovative silicon and packaging technologies from concept through production
Expertise in power semiconductor devices
Expertise in power integrity analysis
Expertise in chiplet integration
Expertise in 2.5D/3D packaging
Expertise in fan-out technologies
Expertise in silicon interposers
Expertise in package reliability and qualification
Systems knowledge of power delivery networks
Systems knowledge of thermal management
Systems knowledge of manufacturing and supply chain considerations
Nice to have6
MS or PhD preferred
Expertise in vertical power delivery
Expertise in backside power distribution networks
Expertise in embedded voltage regulation
Strong patent portfolio and industry recognition
Participation in IEEE, OCP, JEDEC, or semiconductor standards organizations
Skills
GaN
SiC
CMOS
Power integrity analysis
2.5D packaging
3D packaging
Chiplet integration
Silicon interposers
Fan-out packaging
Power delivery networks
Thermal management
Position Summary
The Director of Advanced Power Silicon & Packaging Technology leads the strategy, architecture, development, and deployment of next-generation power delivery technologies spanning silicon, package, and system integration. This role is responsible for driving innovation in power semiconductors, advanced packaging, and silicon-package-system co-optimization for AI, datacenter, networking, and high-performance computing platforms.
The director partners across silicon design, packaging, architecture, manufacturing, and product organizations to deliver breakthrough improvements in power efficiency, power density, performance, reliability, and total cost of ownership.
Key Responsibilities
Technology Strategy & Vision
•
Define and execute the long-term roadmap for:
•
Advanced power silicon technologies
•
Advanced packaging and heterogeneous integration
•
Chip-package-system co-design
•
Vertical power delivery solutions
•
Identify disruptive technologies and assess strategic investment opportunities.
•
Drive technology differentiation and competitive advantage.
Power Silicon Leadership
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Drive adoption of advanced semiconductor technologies including:
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GaN power devices
•
SiC technologies
•
Advanced CMOS and BCD power processes
•
Optimize power efficiency, die area, and reliability.
Advanced Packaging Leadership
•
Establish packaging technology roadmaps for:
•
2.5D and 3D packaging
•
Chiplet architectures
•
Silicon interposers
•
Fan-out packaging
•
Embedded power delivery
•
Co-packaged solutions
•
Lead package electrical, thermal, and mechanical optimization.
•
Drive package innovations enabling higher power density and lower power delivery losses.
Silicon-Package-System Co-Design
•
Lead cross-functional initiatives to optimize:
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Power integrity (PI)
•
Signal integrity (SI)
•
Thermal performance
•
Electromigration reliability
•
Power delivery network (PDN)
•
Develop end-to-end power architectures from regulator to transistor.
Research & Innovation
•
Lead advanced technology incubation and proof-of-concept programs.
•
Build strategic partnerships with:
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Semiconductor foundries
•
OSAT partners
•
EDA vendors
•
Universities and research institutions
•
Create and manage intellectual property portfolios.
•
Drive patent generation and technical publications.
Organizational Leadership
•
Establish a culture of technical rigor, innovation, accountability, and execution excellence.
•
Mentor senior technical leaders and develop organizational capability.
Required Qualifications
Education
•
BS in Electrical Engineering, Physics, Materials Science, or related discipline.
•
MS or PhD preferred.
Experience
•
15+ years of semiconductor and power technology experience.
•
6+ years leading technology, architecture, or engineering organizations.
•
Proven success delivering innovative silicon and packaging technologies from concept through production.
Technical Expertise
Power Silicon
•
Power semiconductor devices
•
Power integrity analysis
Advanced Packaging
•
Chiplet integration
•
2.5D/3D packaging
•
Fan-out technologies
•
Silicon interposers
•
Package reliability and qualification
Systems Knowledge
•
Power delivery networks
•
Thermal management
•
Manufacturing and supply chain considerations
Preferred Qualifications
•
Expertise in:
•
Vertical power delivery
•
Backside power distribution networks
•
Embedded voltage regulation
•
Strong patent portfolio and industry recognition.
•
Participation in IEEE, OCP, JEDEC, or semiconductor standards organizations.