Photonics Packaging Engineer
SalaryNo pay range posted
LocationRemote, Hybrid Remote/SF Bay Area/Austin/Boston
Work modehybrid
Typefull-time
DepartmentAdvanced Packaging
Company size201–500 people
PostedJul 25, 2026 · 2mo ago
Verified live20h ago
At a glanceSummarised by Seekless from the posting.
Experience with integrated photonics package assemblies with multiple dies
Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Experience with large device count photonic assemblies
Experience with clear underfill
Experience with high density fiber attach
Experience with large substrate size photonic MCM assemblies
Hands-on experience with PIC design
What We’re Looking For:
We’re looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background:
•
Experience with integrated photonics package assemblies with multiple dies
•
Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
•
Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have:
•
Experience with large device count photonic assemblies
•
Experience with clear underfill
•
Experience with high density fiber attach
•
Experience with large substrate size photonic MCM assemblies
•
Hands-on experience with PIC design
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