Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)
LocationNTU Main Campus, Singapore
Work modeon-site
Typefull-time
Company size10,000+ people
First seen1w ago
Last seen1d ago
About the role
Centre for Advanced Robotics Technology Innovation (CARTIN) are looking for a hardware-focused Research Associate to design and prototype a compact and heat-resistant multi-sensor payload. The system must withstand temperatures of 250°C for 10 minutes (without external cooling) while maintaining internal stability for embedded electronics.
Key Responsibilities:
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Design compact mechanical housing to operate under 250°C ambient conditions.
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Ensure internal core temperature remains under 55°C during runtime.
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Select and integrate miniaturized components (compute, battery, sensors).
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Strip sensor casings and reassemble into a custom mount with thermal shielding.
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Perform heat simulation, thermal insulation, and shock-resistance design.
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Test hardware in specified sites and environments.
Job Requirements:
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Bachelor or Master in Mechanical Engineering, Mechatronics, or similar.
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Strong experience in heat-resistant enclosure design and miniaturized hardware integration.
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Familiar with thermal simulation tools (ANSYS, SolidWorks, etc.).
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Experience with IP65/ IP67 standards, fanless computing, and embedded design.
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Knowledge of fire-fighting robot or harsh-environment robotic platforms is a plus.
Join our team to build a compact and thermally protected SLAM sensor payload for extreme environments. The candidate will design hardware that survives 250°C conditions while maintaining internal electronics <55°C. Experience with high-temp materials, mechanical CAD, and embedded platform integration is essential. Ideal for Mechatronics/Mechanical engineers with strong prototyping skills.
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