2027校招-封装工程师/Packaging Engineer
Read straight from Texas Instruments's careers page, verified 3d ago.Seekless can tailor your résumé to it.
Seekless can write your résumé for this posting first.
Before you apply
LocationChengdu, Sichuan, China
Typefull-time
SeniorityEntry
DepartmentTMG (Technology Manufacturing Group)
Company size10,000+ people
First seenOct 27, 2026 · 1w ago
Verified live3d ago
At a glanceSummarised by Seekless from the posting.
Partner with businesses and factory manufacturing operations team to develop solutions for semiconductor packaging technologies
Execute design-of-experiments (DOE) on process parameters
Conduct electrical, mechanical, and thermal models to comprehend silicon-to-package interaction
Participate in cross-functional teams supporting product qualification and production
End-to-End Project Management: Lead and drive the full lifecycle of new packaging technologies
Drive the conceptualization and industrialization of innovative packaging solutions
Hands-on Problem Solving: Identify, analyze, and resolve complex technical bottlenecks
Serve as central hub between Business Units and internal technical teams
Proactively identify technical risks and resource constraints
Develop and industrialize Die Preparation process (Back Grind, Wafer Taping & Mount, Wafer Saw - Dicing)
Support wafer dicing/singulation process development across laser dicing, plasma dicing and mechanical saw technologies
Develop and industrialize Epoxy Dispense Die Attach process
Die Preparation and Die Attach process Development & Characterization, Qualification, and production pilot run
Skills
Die prep
Die attach
Wire bond
Flip Chip
Modules
SIPs
Wafer Backgrind
Wafer Singulation
Epoxy Dispense Die Attach
Laser dicing
Plasma dicing
Mechanical saw
Benefits
Competitive pay
Health insurance
Career development
About the role
In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.
Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI’s analog and embedded processing products. TI’s innovative packaging technologies are designed to solve customers’ problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you’ll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!
Responsibilities
Packaging engineers play an important role at TI which encompasses the following responsibilities:
•
Partner with the businesses and the factory manufacturing operations team to develop solutions for semiconductor packaging technologies in areas, including Die prep, Die attach, Wire bond, Flip Chip, Modules, SIPs and other advanced packages
•
Execute design-of-experiments (DOE) on process parameters and work with material suppliers to down select innovative packaging materials to enhance the reliability and performance of advanced packages.
•
Conduct electrical, mechanical, and thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high-risk designs.
•
Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
•
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the top engineering minds in the industry at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the workplace-you will be treated with respect, dignity, kindness and courtesy.
1.
Hiring Role function
PM Role:
•
End-to-End Project Management: Lead and drive the full lifecycle of new packaging technologies, ensuring all technical milestones, quality gates, and timelines are met across multiple product platforms.
•
Innovation & Technology Introduction: Drive the conceptualization and industrialization of innovative packaging solutions; stay abreast of emerging assembly trends and integrate new materials or methodologies into TI’s technology roadmap.
•
Hands-on Problem Solving: Take a proactive, hands-on approach to identify, analyze, and resolve complex technical bottlenecks during the development and qualification phases, ensuring robust technology transfers.
•
Cross-Functional Orchestration: Serve as the central hub between Business Units (BU) and internal technical teams (Design, Process, Quality, Operation and Manufacturing) to synchronize requirements and resolve complex integration issues.
•
Risk & Resource Management: Proactively identify technical risks and resource constraints; coordinate cross-departmental support to ensure seamless technology transitions and successful mass production.
PreBond DA Role:
•
Hiring position is for Wafer Backgrind, Wafer Singulation and Die Attach process
•
Develop and industrialize Die Preparation process (Back Grind / Wafer Taping & Mount / Wafer Saw - Dicing) including equipment, new process methodology, and introduce materials to meet quality, cost, yield and mission of new applications.
•
Support wafer dicing/singulation process development across laser dicing, plasma dicing and mechanical saw technologies.
•
Develop and industrialize Epoxy Dispense Die Attach process, to meet quality, cost, yield and mission of new applications.
•
Die Preparation and Die Attach process Development & Characterization, Qualification, and production pilot run to improve package performance on quality, cost, reliability and application.
Put your talent to work with us as a Packaging engineer!
Why TI?
•
Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
•
We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
•
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Legal
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
Hiring process
If you are interested in this position, please apply to this requisition.