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Director, Back-End Engineering

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Before you apply
LocationJapan - Sagamihara
Work modeon-site
Typefull-time
SeniorityDirector
Experience10+ yrs
DepartmentEngineering
Company size10,000+ people
PostedOct 13, 2026 · 3w ago
Verified live14h ago
At a glanceSummarised by Seekless from the posting.
High-level role and responsibility on the Back-End (BE) Engineering team as a Director Job level for leading huge volume Chip Mass Production like over 20-30 million pcs level per quarter
Lead to support Fab operation for huge volume Laser Chip Mass Production line as BE Engineering team as Director job level management
High knowledge and sufficient experience in terms of BE technology and/or Fab operation
Chip production line process setup and aggressive improvement (TTR: Test Time Reduction etc)
Chip yield improvement and production line capacity ramp up by strategical planning (KAIZEN, Capex) and execution
Deployment and utilize effective KPI metrics (CT, TAKT, LT) to improve BE production line efficiency
Fluent Japanese speaker for leading and managing of Fab and business level English speaking skill for high-level presentations
BSc, MSc, PhD degree in electronics, electrical engineering, physics, or a related equivalent technical field
Bachelors and 20+ years of work experience, Masters and 15+ years of work experience, PhD and 10+ years of work experience
Experience in manager class in the Semiconductor Fab or Chip design and/or process development for semiconductor optical devices
Skills
KAIZEN
About the company
It’s fun to work in a company where people truly BELIEVE in what they’re doing!
We’re committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you’ll enjoy your career with us!
Job Description
At present, the market demand of ultra-high-speed Laser Chip is remarkably increasing from viewpoint of dramatical deployment to not only Mega Data Center but rapid growth for AI/ML application. To address the worldwide demand, Lumentum is operating Fab under 7x24 operation to produce state-of-the-art chip production. This applicant should have a high-level role and responsibility on the Back-End (BE) Engineering team as a Director Job level for leading huge volume Chip Mass Production like over 20-30millionn pcs level per quarter.
Responsibilities:
•
Lead to support of Fab operation for huge volume Laser Chip Mass Production line as BE Engineering team as Director job level management.
•
High knowledge and sufficient experience in terms of BE technology and/or Fab operation.
•
Chip production line process setup and its aggressive improvement (TTR: Test Time Reduction etc)
•
Chip yield improvement and production line capacity ramp up by strategical planning (KAIZEN, Capex) and its execution.
•
Deployment and utilize effective KPI metrics (CT, TAKT, LT) to improve BE production line efficiency.
•
Fluent Japanese speaker for leading and managing of Fab and business level English speaking skill for high-level presentations.
Expected Background:
•
BSc, MSc, PhD degree in electronics, electrical engineering, physics, or a related equivalent technical field.
•
Bachelors and 20+ years of work experience, Masters and 15+ years of work experience. PhD and 10+ years of work experience s.
Expected Skill:
Nice to have
•
Highly recommend if applicant have experience in manager class in the Semiconductor Fab or Chip design and/or process development for semiconductor optical devices.
Legal
We are an equal opportunity employer and value diversity at our company.
We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.
We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.
Please contact us to request accommodation.