Technical Program Manager (MCL)
LocationTWN - Taipei - Taipei
Company size10,000+ people
PostedOct 7, 2026 · 6d ago
Verified live1d ago
At a glanceSummarised by Seekless from the posting.
Highly analytical and strategic thinker with quality and reliability of product in mind
Skilled in DFx (x = manufacturability, reliability, and/or test)
Comfortable in operating with ambiguity in fast-evolving technology markets
Excellent communication skills in English; Mandarin proficiency strongly preferred
Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution
Prior experience in electronic packaging industry and/or chip design industry
Established relationships within OSATs, ODMs and/or chip vendors
Nice to have
Preferred
•
Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.
•
Prior experience in electronic packaging industry and/or chip design industry
•
Established relationships within OSATs, ODMs and/or chip vendors
Requirements
Skills & Attributes
•
Highly analytical and strategic thinker with quality and reliability of product in mind
•
Skilled in DFx (x = manufacturability, reliability, and/or test)
•
Comfortable in operating with ambiguity in fast‑evolving technology markets
•
Excellent communication skills in English; Mandarin proficiency strongly preferred