• Lead concept development for advanced packages (e.g., fan out wafer level, 2.5 D/3 D interposer, system in package).
• Produce detailed layout for substrates, interposers, and die to die routing using Siemens Xpedition.
• Own package-level SI/PI strategy, including high speed digital interfaces, power delivery network (PDN) design, and decoupling strategy.
• Perform SPICE, EM, and S parameter simulations to validate SI, PDN, and crosstalk.
• Partner with mechanical engineers and analysts on die attach, under fill, molding, and thermal interface materials.
• Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces.
• Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
• Author complete package build documentation, specifications, and test plans.
• Drive solutions to complex problems with limited direction – contribute to requirements development, propose paths forward, and adapt appropriately to changes in requirements.