Lead the research and development of next-generation packaging materials, including but not limited to: Epoxy die-attach adhesives, Molding compounds for fan-out, SiP, and other advanced packages, underfill materials. Define material specifications, performance targets (thermal, mechanical, electrical, reliability), and qualification plans. Conduct deep-dive technical analysis on material properties, failure mechanisms, and process compatibility. Collaborate with material suppliers, internal process engineering, and reliability teams to optimize material formulation and performance. Identify, evaluate, and onboard qualified domestic materials suppliers as 2nd sources. Lead the technical assessment, including material characterization, comparative testing, and process window evaluation against baseline materials. Manage the full qualification cycle for new suppliers/materials, from initial samples to production release, ensuring they meet all quality, reliability, and cost requirements.