Senior Engineer II, Process Engineering
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Before you apply
LocationLeuven(ASM Belgium N.V.), Belgium > Leuven
Typefull-time
SenioritySenior
Experience3+ yrs
DepartmentSU4. Memory
Company size10,000+ people
PostedOct 30, 2026 · 4d ago
Verified live1d ago
At a glanceSummarised by Seekless from the posting.
PhD degree in applied physics, materials science, electrical engineering, with a thesis related to the semiconductor (or adjacent industries)
3+ years of industrial experience in semiconductor R&D field
In depth understanding of electrical properties of semiconductors, metals and dielectrics as well as key device building blocks (MIMCAP, MOSCAP, MOSFET)
Demonstrated understanding of memory applications, operation, integration, challenges (DRAM, NAND)
Demonstrated in depth understanding of semiconductor physics
Proven ability to interpret and cross-correlate electrical and physical characterization data
Prior experience with thin film deposition techniques (e.g., ALD, CVD) and their characterization methods (e.g., XPS, AFM, XRD, XRF, electrical characterization and ellipsometry)
A curious mindset, able to synthesize the complex and drive pragmatic solutions forward
Serve as the bridge between materials/analytical groups and device/integration teams, turning disparate datasets into a coherent physical picture
Ability to plan, execute and communicate projects from beginning to end and across stakeholders
The passion and drive to take charge of your career, grabbing professional and personal development opportunities with both hands
Build root-cause understanding by correlating electrical device behavior with physical/compositional analysis (TEM, XPS, XRD, SIMS, EELS, etc.)
Interpret electrical signatures (CET/EOT, Vfb/Vt shifts, leakage, trapping, reliability trends) in terms of underlying materials properties
Translate combined physical–electrical insight into clear guidance for materials selection, process tuning, and integration decisions across DRAM and NAND technologies
Familiarity with new memory architectures such as 3D DRAM and 4F2 DRAM technologies
Skills
ALD
CVD
XPS
AFM
XRD
XRF
ellipsometry
TEM
SIMS
EELS
Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
Requirements
Job description:
•
A PhD degree in applied physics, materials science, electrical engineering, with a thesis related to the semiconductor (or adjacent industries)
•
3+ years of industrial experience in semiconductor R&D field
•
In depth understanding of electrical properties of semiconductors, metals and dielectrics as well as key device building blocks (MIMCAP, MOSCAP, MOSFET)
•
Demonstrated understanding of memory applications, operation, integration, challenges (DRAM, NAND)
•
Demonstrated in depth understanding of semiconductor physics.
•
Proven ability to interpret and cross-correlate electrical and physical characterization data.
•
Prior experience with thin film deposition techniques (e.g., ALD, CVD) and their characterization methods (e.g., XPS, AFM, XRD, XRF, electrical characterization and ellipsometry)
•
A curious mindset, able to synthesize the complex and drive pragmatic solutions forward
•
Serve as the bridge between materials/analytical groups and device/integration teams, turning disparate datasets into a coherent physical picture.
•
Ability to plan, execute and communicate projects from beginning to end and across stakeholders
•
The passion and drive to take charge of your career, grabbing professional and personal development opportunities with both hands.
Responsibilities
Core Function
•
Build root-cause understanding by correlating electrical device behavior with physical/compositional analysis (TEM, XPS, XRD, SIMS, EELS, etc.).
•
Interpret electrical signatures (CET/EOT, Vfb/Vt shifts, leakage, trapping, reliability trends) in terms of underlying materials properties — interface chemistry, defect density, crystallinity, layer intermixing, and stack integration effects.
•
Translate combined physical–electrical insight into clear guidance for materials selection, process tuning, and integration decisions across DRAM and NAND technologies.
•
Familiarity with new memory architectures such as 3D DRAM and 4F2 DRAM technologies.
Apply today to be part of what’s next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
Legal
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.