Principal Die-to-Die Interconnect Modeling Architect
Read straight from Broadcom's careers page, verified 3d ago.Seekless can tailor your résumé to it.
Seekless can write your résumé for this posting first.
Before you apply
Salary$168k – $268k
LocationUSA-CA San Jose Innovation Drive; USA-Colorado-Fort Collins-4380 Ziegler Road
SeniorityLead
Experience12+ yrs
EquityIncluded
Company size10,000+ people
PostedOct 8, 2026 · 4w ago
Verified live3d ago
At a glanceSummarised by Seekless from the posting.
MS in Electrical Engineering, Computer Engineering, and 15 or more years in related field experience; or PhD in Electrical Engineering, Computer Engineering, and 12 or more years in related field experience
Deep understanding of communication theory, equalization, and adaptive algorithms
Experience in high-speed SerDes, or D2D communication systems architecture
Extensive experience developing behavioral and architectural models using MATLAB, Python, SystemC, or equivalent tools
Experience with architecture model to RTL to verification
Experience leading architectural verification, silicon correlation, and performance validation across multidisciplinary engineering teams
Demonstrated expertise in D2D, UCIe, or other short-reach die-to-die communication
Expertise in advanced packaging including silicon interposers, EMIB, hybrid bonding, and 3D integration
Management experience
Skills
MATLAB
Python
SystemC
Benefits
Medical
Dental
Vision
401(k)
ESPP
EAP
Paid sick leave
Paid vacation
Paid family leave
Equity
Annual bonus
Please Note:
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:
We are seeking a Modeling Architect to lead a technical team in building and evolving our foundational modeling platform for die-to-die (D2D) PHYs designs. This role focuses on communication theory, algorithm development, system-level modeling, performance prediction, adaptation algorithm modeling, and architectural verification
The successful candidate will perform evaluation and tradeoff analysis using statistical tools over different signaling schemes (e.g., NZR vs. other), and analyze hardware architecture and implementation tradeoffs (equalization, error terms, noise budgets, etc.). Leading a technical team, the architect will drive algorithm verification of Verilog implementations, predictive adaptation algorithm run-time modeling, Monte Carlo evaluations of adaptation algorithms, and architectural verification with silicon correlation to achieve high model-to-silicon alignment.
This role requires deep technical understanding of communication algorithms, timing and margin budgeting, equalization and error term analysis, and focus on cross-functional technical leadership.
Key Responsibilities
System Modeling and Performance Prediction
•
Develop comprehensive behavioral and architectural models that accurately predict complete link behavior before implementation.
•
Build system-level models using MATLAB, Python, SystemC, or equivalent modeling environments.
•
Model transmitter, receiver, package, channel, clocking, equalization, adaptation, and protocol interactions.
•
Predict link performance including BER, latency, throughput, bandwidth density, power consumption, energy efficiency, and manufacturing margin.
•
Perform architectural sensitivity analyses across process, voltage, temperature (PVT), aging, package variation, jitter, noise, and channel impairments.
•
Apply communication theory to help develop robust, high-performance signaling architectures.
•
Analyze equalization, timing recovery, clock recovery, calibration, and adaptive signal processing algorithms.
•
Evaluate convergence behavior, numerical stability, hardware efficiency, and implementation feasibility.
•
Guide algorithm development from mathematical concepts through production silicon implementation.
•
Model deterministic and random timing uncertainties including jitter, skew, supply noise, process variation, and environmental effects.
•
Establish margin methodologies that ensure robust operation across manufacturing and operating conditions.
•
Collaborate with implementation teams to ensure timing assumptions are achievable in silicon.
Architectural Verification and Silicon Correlation
•
Define the architectural verification strategy to ensure system requirements are traceable from concept through production silicon.
•
Develop behavioral reference models that serve as the golden standard for RTL implementation, verification, software development, and silicon validation.
•
Establish architecture-level performance metrics, verification methodologies, and success criteria.
•
Drive correlation between behavioral models, RTL simulation, laboratory characterization, and production silicon.
•
Validate architectural assumptions through simulation and silicon measurements, identifying performance gaps and driving corrective actions.
•
Develop verification methodologies that account for implementation effects including finite precision, analog non-idealities, and hardware constraints.
•
Define comprehensive validation strategies covering nominal operation, corner cases, interoperability, and robustness across all operating conditions.
Technical Leadership
•
Provide technical leadership across architecture, analog, digital, firmware, packaging, signal integrity, verification, validation, and product engineering organizations.
•
Lead architecture reviews and critical technical decision-making throughout the product lifecycle.
•
Mentor engineers and architects in communication systems, modeling, and architecture development.
•
Influence technology roadmaps and drive innovation in next-generation die-to-die communication systems.
Required Qualifications
•
MS in Electrical Engineering, Computer Engineering, and 15 or more years in related field experience; or PhD in Electrical Engineering, Computer Engineering, and 12 or more years in related field experience.
•
Deep understanding of communication theory, equalization, and adaptive algorithms.
•
Experience in high-speed SerDes, or D2D communication systems architecture.
•
Extensive experience developing behavioral and architectural models using MATLAB, Python, SystemC, or equivalent tools.
•
Experience with architecture model to RTL to verification
•
Experience leading architectural verification, silicon correlation, and performance validation across multidisciplinary engineering teams.
Desired Qualifications
•
Demonstrated expertise in D2D, UCIe, or other short-reach die-to-die communication.
•
Expertise in advanced packaging including silicon interposers, EMIB, hybrid bonding, and 3D integration.
•
Management experience
Compensation and Benefits
The annual base salary range for this position is USD 167,500.00 To USD 268,000.00
As a valued member of our team, you’ll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company’s growth. All subject to relevant plan documents and award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.