Astera Labs is establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical ‘data bottlenecks’ enabling the future of AI at scale. As we expand our presence in Israel, we’re seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world’s largest AI clusters.
As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling Astera Labs’ products to operate reliably in the world’s most demanding AI and cloud environments.