PDC(XVision) Process Support Engineer
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Before you apply
LocationCheongJu,KOR; Icheon-Godam,KOR
Work modeon-site
Typefull-time
SeniorityMid
Experience4–7 yrs
DepartmentEngineering
Company size10,000+ people
PostedOct 26, 2026 · 1w ago
Verified live1d ago
At a glanceSummarised by Seekless from the posting.
Bachelor's degree in materials science/engineering, physics, chemistry, electrical engineering, optoelectronics, or a related field
4–7 years of experience in memory fab, HBM/back-end packaging, or semiconductor equipment industry, preferably in Inspection/Metrology or failure analysis
Hands-on experience with data analysis and statistics (e.g., JMP, Python, MATLAB) and with structured problem solving / root cause analysis
Strong interpersonal and communication skills to explain sensitive technical information and build consensus among customer and internal stakeholders
Communication proficiency in English (written and verbal)
Master's degree or PhD in a related field
Experience with X-ray CT/XRM, 2D X-ray inspection, or 3D image analysis (reconstruction, segmentation, volume metrology)
Knowledge of HBM stacking processes: TSV, microbump plating, MR-MUF / TC-NCF bonding, hybrid bonding, and underfill
Experience with failure analysis methods (cross-section, SEM/FIB, SAT/C-SAM) and correlating them with inline or electrical test data
Experience applying machine learning / deep learning to image data (denoising, super-resolution, defect detection/classification)
Experience leading customer evaluations, demos, or joint development projects with memory customers
Skills
JMP
Python
MATLAB
X-ray CT
XRM
2D X-ray inspection
3D image analysis
machine learning
deep learning
Benefits
Health insurance
Retirement plan
Professional development
Who We Are
Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.
What We Offer
Location:
CheongJu,KOR, Icheon-Godam,KOR
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
About the role
As a Process Support Engineer (PSE), you’ll play a critical role in guiding products through their entire lifecycle, from initial concept to final qualification. You will provide high-visibility customer support through on-site installations, system diagnoses, and the service and repair of complex systems and equipment. PSEs work closely with customers and R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, and create hypothesis experiments and design of experiments (DOEs). You’ll analyze data with statistics and compile reports with high-level conclusions on technically challenging process engineering experiments. Additionally, you will troubleshoot complex problems, perform root cause analyses, and resolve difficult process engineering and customer product issues. Process Support Engineers work across technologies such as: Chemical Vapor Deposition, Atomic Layer Deposition, Plasma Reactive Ion Etch, Physical Vapor Deposition, Anneal and Implant.
About the Role:
As a Process Support Engineer (PSE) for Applied Materials’ 2D/3D X-ray inspection and metrology platform, you will play a critical role in bringing a new non-destructive inspection capability into high-volume HBM (High Bandwidth Memory) manufacturing at a leading memory customer. You will lead customer demos and evaluations, develop imaging and analysis recipes, and translate 3D X-ray data into actionable yield insight correlating X-ray results with electrical test, physical failure analysis, and process data.
Working closely with the customer’s HBM process, integration, and FA(Failure Analysis) teams, the PDC (Process Diagnostic and Control) organization, and the global X-ray product/R&D team, you will help define how X-ray inspection and metrology are used to control microbump, TSV, and die-stacking processes for next-generation HBM generations.
Role Responsibilities:
•
Drive X-ray inspection tool adoption at the customer, from demo to joint development and tool installation, with on-site support for qualification and issue resolution
•
Develop and optimize 2D/3D X-ray imaging recipes for HBM stacks (microbumps, TSVs, hybrid-bonding interfaces), balancing resolution, sensitivity, and throughput
•
Detect and quantify yield-critical defects (non-wet, bridging, voids, cracks) and stack metrology (bump height, die shift, tilt)
•
Apply automated analysis and AI/ML-based image enhancement; design DOEs and correlate X-ray data with electrical test and FA results
•
Serve as the technical liaison between the customer and the global X-ray product team, feeding field requirements into the roadmap
•
Act as a resource for junior colleagues and lead small projects with manageable risk and resource requirements
Minimum Qualifications:
•
Bachelor’s degree in materials science/engineering, physics, chemistry, electrical engineering, optoelectronics, or a related field
•
4–7 years of experience in memory fab, HBM/back-end packaging, or semiconductor equipment industry, preferably in Inspection/Metrology or failure analysis
•
Hands-on experience with data analysis and statistics (e.g., JMP, Python, MATLAB) and with structured problem solving / root cause analysis
•
Strong interpersonal and communication skills to explain sensitive technical information and build consensus among customer and internal stakeholders
•
Communication proficiency in English (written and verbal)
Preferred Qualifications:
•
Master’s degree or PhD in a related field
•
Experience with X-ray CT/XRM, 2D X-ray inspection, or 3D image analysis (reconstruction, segmentation, volume metrology)
•
Knowledge of HBM stacking processes: TSV, microbump plating, MR-MUF / TC-NCF bonding, hybrid bonding, and underfill
•
Experience with failure analysis methods (cross-section, SEM/FIB, SAT/C-SAM) and correlating them with inline or electrical test data
•
Experience applying machine learning / deep learning to image data (denoising, super-resolution, defect detection/classification)
•
Experience leading customer evaluations, demos, or joint development projects with memory customers
•
Understanding of X-ray physics fundamentals (source/detector, contrast, dose, artifacts) is a plus
Additional Information
Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 20% of the Time
Relocation Eligible:
No
Legal
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.
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