Package Technology Development Manager
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Before you apply
Typefull-time
SeniorityLead
Experience5+ yrs
DepartmentEngineering
Company size1,001–5,000 people
PostedAug 12, 2025 · 1y ago
Verified live5h ago
May no longer be actively hiring
Posted by the company on Aug 12, 202563% of this company's open roles have been listed for 90+ days
At a glanceSummarised by Seekless from the posting.
Intensive hands-on experience on package technology and process development
Proficient in different processes of package, such as wafer grinding, wafer saw, die attach, flip chip die attach, plasma clean, wire bond, molding process, laser ablation, laser marking process
Bachelor/master's degree with 10+ years directly related experience, or Doctor degree with 5+ related experience
Sufficient knowledge about semiconductor supply chain, be familiar with assembly sub-con, package BOM vendor
Fluent oral and written English
Work proactively
Have machine maintenance knowledge
Skills
wafer grinding
wafer saw
die attach
flip chip die attach
plasma clean
wire bond
molding process
laser ablation
laser marking process
About the company
Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about sustainability, and are committed to providing leading-edge products and innovation to our customers. Our portfolio of technology helps power our world —come join our team and see how YOU can make a difference.
Job Description:
Summary:
New package technology development Path-finding for new package related process flow Lead new package material study and qualification.
RESPONSIBILITIES:
Lead a team to develop new package technology and related process flow. Survey new material to make package more reliable, more robust and competitive. Work with assembly house and material vendor to develop and qualify the new materials and new package. Coordinates the qualification of new materials, package, assembly processes, and drive the evaluation for supplier current process and material change. Qualify new supplier and develop current supplier capability and manage supplier relationship. Sum up the experience of Package process, SMT process and maintain/update the assembly baseline. Perform other tasks assigned by supervisor.
REQUIREMENTS:
Intensive hands-on experience on package technology and process development. Be proficient in different processes of package, such as wafer grinding, wafer saw, die attach, flip chip die attach, plasma clean, wire bond, molding process, laser ablation, laser marking process, and etc. Bachelor/master’s degree with 10+ years directly related experience, or Doctor degree with 5+ related experience. Sufficient knowledge about semiconductor supply chain, be familiar with assembly sub-con, package BOM vendor. Fluent oral and written English is required. Have machine maintenance knowledge is a plus. Work proactively.
Legal
Monolithic Power Systems, Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.