Familiarity with various packaging technologies including organic and ceramic substrates. Wafer level packaging and 2.5D/3D assembly processes as well as those listed below. Identifying and initiating business with substrate suppliers and assembly houses. Working through the design process mechanically, thermally and electrically to create the optimal solution while staying within supplier manufacturing capabilities. Creating CAD models for simulation and performing simulations to verify designs prior to release.
Own process definition and control for automated microlens alignment and bonding. Program motion sequences, optimize camera and vision-based routines, and tune process parameters (alignment offsets, bonding dwell, UV cure profiles, placement forces) to achieve sub-micron accuracy and high yield.
Die Placement Process Ownership:
Define and maintain process parameters for high-precision die-attach and placement equipment. Drive correlation between pick-and-place accuracy, epoxy flow, and bond-line thickness for consistent optical coupling.
Epoxy and Adhesive Dispense Control:
Establish and control parameters for automated dispense systems. Develop dispense recipes controlling needle diameter, pressure, time, temperature, and material conditioning. Characterize cure profiles and shrinkage impacts on optical alignment stability.
Design and execute structured DOEs to characterize process sensitivity and optimize yield. Use statistical methods to quantify variability and identify dominant factors affecting alignment accuracy, void formation, or optical loss.
Reliability and Qualification:
Familiarity with microelectronics and photonics reliability and qualification standards such as Telecordia, JESD47 and AEC-Q. Also able to lead Root Cause Corrective Actions (RCCAs) with suppliers, Design and Process FMEA’s and DOE planning.
Define measurement methods and run GR&R studies on critical parameters (e.g., placement accuracy, epoxy volume, bond-line thickness). Ensure metrology tools and data systems at the CM are calibrated and controlled.
Factory Execution and Scale-Up:
Lead the implementation of robotics, automation, and material handling solutions by partnering with automation suppliers and contract manufacturers to enable scalable, high-throughput production. Drive failure analysis (FA) and corrective actions (CA) on process-related issues, and continuously improve yield, throughput, and takt time. Partner with the contract manufacturer to qualify processes, train operators, and own line readiness for precision optical assembly builds.