Packaging Engineering Intern - Winter
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Before you apply
Salary$108k – $126k
LocationAustin
Also inLockhart, TX; San Francisco, CA
Work modeon-site
Typeinternship
SeniorityEntry
DepartmentInternships & Co-ops
Company size201–500 people
PostedAug 27, 2026 · 2mo ago
Verified live2d ago
At a glanceSummarised by Seekless from the posting.
Pursuing a Bachelor's Degree or higher in engineering
At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
Hands-on prototyping experience and the ability to move through design cycles quickly
Portfolio required to apply: show us the things you've actually built!
If you've shipped a medium-to-high complexity system through a personal project or previous internship, you'd be a good fit here
Proven experience in mechatronics or electromechanical system design
Familiarity with lasering and 3D printing (stereolithography)
Reliability testing, soldering, and reflow testing
Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)
Skills
Solidworks
Onshape
3D printing
metal plating
lasering
metrology
soldering
reflow testing
SEM
thin film measurement
X-ray
Benefits
Health insurance
401(k)
Paid time off
Visa sponsorship
Commuter benefits
Life insurance
Disability insurance
About fab2
The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves.
We’re looking for exceptional, hands-on people who can iterate to the limits of what’s possible.
fab2 was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.
About the Role
We’re hiring Semiconductor Packaging Engineering Interns for the winter term. The internship begins in January, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology.
Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply: show us the things you’ve actually built! If you’ve shipped a medium-to-high complexity system through a personal project or previous internship, you’d be a good fit here.
Responsibilities
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Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
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Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
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Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
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Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)
Required Experience
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Pursuing a Bachelor’s Degree or higher in engineering
•
At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
•
Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
•
Hands-on prototyping experience and the ability to move through design cycles quickly
Nice-to-have
•
Proven experience in mechatronics or electromechanical system design
•
Familiarity with lasering and 3D printing (stereolithography)
•
Reliability testing, soldering, and reflow testing
•
Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)
Working at fab2
We’re an early-stage hardware startup with solid funding, world-class advisors, and labs/offices in Austin, TX, Lockhart, TX, and San Francisco, CA. fab2 is committed to fair and equitable compensation. Packaging Interns are paid hourly, at a rate equivalent to an annualized range of $108,000–$126,000 depending on experience and education. Actual earnings vary with hours worked.
Internship Benefits:
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Housing Stipend to help with first month expenses
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Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts
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Weekly Learning & Development opportunities
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Commuter Benefits including Parking and Late Night Uber rides from the office
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Paid Time Off inclusive of Holidays and Sick Time
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Visa Sponsorship
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Medical, Dental, and Vision insurance
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401(k) retirement plan
•
Life and Disability Insurance
Legal
We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses.
Export Control Analysis: This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.
fab2, formerly known as Atomic Semi