Day-to-Day Responsibilities:
🔹Lead cleanroom assemblers while ensuring compliance with strict quality standards (MIL-PRF-38534, MIL-PRF-38535 and MIL-STD-883).
🔹Experience with advanced processes such as wire bonding (gold & aluminum), die attach (epoxy, eutectic solder), and lid sealing (solder, Seam welding, Projection welding).
🔹Familiarization and Programming of advanced equipment, including Die Bonders, Wire bonders, Seam Welders.
🔹Assemble custom packaging, including ceramic LCCs, flatpacks, CQFP, TSOP, ASICs, multichip modules.
🔹Train and certify new employees in cleanroom processes.
🔹Capable of conducting and training technicians to QML Q and V level inspections on microelectronics using microscopes.