Senior Process Engineer - Deposition
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Before you apply
Salary$110k – $165k
LocationGoleta, CA, Goleta, United States
Work modeon-site
Typefull-time
SenioritySenior
Experience5+ yrs
DepartmentProcess Engineering
Company size51–200 people
PostedMay 1, 2026 · 6mo ago
Verified live1d ago
May no longer be actively hiring
Posted by the company on May 1, 202671% of this company's open roles have been listed for 90+ days
At a glanceSummarised by Seekless from the posting.
B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline
5+ years of experience in a semiconductor microfabrication manufacturing environment
Deep understanding of material properties and the specific process knobs required to obtain them
Expert-level proficiency in JMP for data analysis, statistical modeling, and DOE
Proven track record of hands-on hardware troubleshooting. Ability to diagnose mechanical, electrical, and vacuum-related failures
Skills
JMP
PVD
RF Sputtering
DC Magnetron Sputtering
Pulsed DC Magnetron Sputtering
Ion Beam Deposition (IBD)
E-beam evaporation
CVD
ALD
PECVD
HDPCVD
LPCVD
oxidation furnaces
annealing
RTP/RTA
Bosch process (DRIE)
dielectric etching
plasma ashing
Ion Beam Etching (IBE)
About Atomica:
Atomica is a U.S.-based MEMS and microfabrication foundry. We partner with customers to develop and manufacture leading-edge technologies for applications in medical devices, aerospace, photonics, artificial intelligence (AI), and sensing and other advanced industries.
We bring together multidisciplinary teams of engineers and manufacturing experts to transform complex concepts into commercially-viable products that enable the next generation of innovation.
About the Position:
Atomica is seeking a driven Process Engineer to join our Surface Engineering, with a primary focus on deposition. We are looking for someone who can support existing production processes and develop processes for new programs (20+) focusing on product quality and manufacturability. Collaboration is a must as you work closely with the integration, manufacturing engineering, maintenance and production teams on development of new processes, selection of new equipment/technology, standardization and problem resolution. This role is designed for a technical leader who thrives at the intersection of advanced materials and complex vacuum hardware.
Primary Responsibilities
1. New Process & Tool Development
•
End-to-End Development: Design and execute recipes for new thin-film applications, ensuring strict adherence to required material properties (mechanical, optical and electrical characteristics).
•
Integration Collaboration: Partner with the integration team to ensure surface engineering solutions meet functional requirements for complex devices
•
Tool Qualification: Lead the technical evaluation, installation, and testing of new capital equipment to meet production-ready standards.
•
DOE & Optimization: Design and execute Design of Experiments (DOE) to determine process windows and optimize results. Strong fundamentals in data analysis and demonstrated critical thinking skills
2. Advanced Troubleshooting & Root Cause Analysis
•
Early-Stage & Production Support: Identify and resolve fundamental process instabilities during early-stage R&D while maintaining the discipline to lead “Task Force” efforts for chronic production excursions.
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Hardware-Process Mastery: Act as the primary technical expert for resolving complex process-hardware interactions.
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Tool Troubleshooting: Help perform diagnostics on vacuum systems, RF power delivery, and gas flow controllers. Hands-on experience is highly valued.
3. Sustaining & Standardization
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Statistical Process Control (SPC): Implement and monitor SPC charts in JMP to identify trends, prevent excursions, and ensure long-term process stability.
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Standardization: Author and maintain high-quality Standard Operating Procedures and technical documentation to ensure cross-shift consistency.
Technical Expertise Preferred
Deposition (Primary Focus)
•
PVD: Experience with RF, DC, and Pulsed DC Magnetron Sputtering, Ion Beam Deposition (IBD) and E-beam evaporation
•
CVD & ALD: Deep knowledge of PECVD, HDPCVD, ALD, and LPCVD.
•
Thermal: Proficiency in oxidation furnaces, annealing, and RTP/RTA.
Dry Etch & Clean
•
Plasma Processing: Hands-on experience with Bosch process (DRIE), dielectric etching, plasma ashing, and Ion Beam Etching (IBE)
Required Qualifications
•
B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline.
•
5+ years of experience in a semiconductor microfabrication manufacturing environment.
•
Deep understanding of material properties and the specific process knobs required to obtain them.
•
Expert-level proficiency in JMP for data analysis, statistical modeling, and DOE.
•
Proven track record of “hands-on” hardware troubleshooting. Ability to diagnose mechanical, electrical, and vacuum-related failures.
Compensation
The base pay range for this role is $110,000 – $165,000 per year.