Packaging Engineer
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LocationTW,Hsinchu-Rant Plaza, Taiwan
Work modeon-site
Typefull-time
SeniorityLead
DepartmentEngineering
Company size10,000+ people
First seenOct 30, 2026 · 4d ago
Verified live21h ago
At a glanceSummarised by Seekless from the posting.
Self-motivated and able to work independently with minimal supervision
Excellent communication skills to collaborate with internal and external partners
Established relationship with industry partners in advanced assembly technology, specifically in large module on substrate assembly
Minimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent
Demonstrated leadership skills in managing OSATs and teams with various backgrounds
In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc.
Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience
Well verse in typical technology development tools, FMEA, SPC, control plans, etc.
Ability to communicate well in both English and Chinese language
AMD is an equal opportunity, inclusive employer
AMD may use Artificial Intelligence to help screen, assess or select applicants
This posting is for an existing vacancy
Skills
FMEA
SPC
ADVANCE YOUR CAREER. ADVANCE THE WORLD.
At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.
THE ROLE:
Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements.
THE PERSON:
This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly.
KEY RESPONSIBILITIES:
•
Drive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables.
•
Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs.
•
Establish ecosystem partners to identify assembly capability improvement roadmap
PREFERRED EXPERIENCE:
•
Demonstrated leadership skills in managing OSATs and teams with various backgrounds
•
In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc…
•
Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience.
•
Well verse in typical technology development tools, FMEA, SPC, control plans, etc…
•
Ability to communicate well in both English and Chinese language
ACADEMIC CREDENTIALS:
•
Minimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.
LOCATION:
Hsinchu / Kaohsiung Taiwan
Benefits
Benefits offered are described: AMD benefits at a glance.
Legal
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
Benefits offered are described: AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.
THE ROLE:
Main role is to lead assembly technology development with OSAT and foundry partners. In parallel this individual is also expected to drive technology development across the industry to meet future requirements.
THE PERSON:
This individual should be self-motivated and is able to work independently with minimal supervision. Excellent communication skills to collaborate with both internal and external partners. Established relationship with industry partners in the field of advanced assembly technology specifically in large module on substrate assembly.
KEY RESPONSIBILITIES:
•
Drive OSAT to develop advanced assembly technology capabilities to meet technology development deliverables.
•
Collaborate with integration and design teams to integrate assembly and design needs. Formulate plans to enhance assembly capabilities to meet design needs.
•
Establish ecosystem partners to identify assembly capability improvement roadmap
PREFERRED EXPERIENCE:
•
Demonstrated leadership skills in managing OSATs and teams with various backgrounds
•
In depth process knowledge of key assembly processes: die prep, various die bond methods, underfill, lid attach etc…
•
Hands-on experience on large module/die assembly challenges, chip on wafer/panel and chip on substrate experience.
•
Well verse in typical technology development tools, FMEA, SPC, control plans, etc…
•
Ability to communicate well in both English and Chinese language
ACADEMIC CREDENTIALS:
•
Minimum Msc, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or equivalent.
LOCATION:
Hsinchu / Kaohsiung Taiwan
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