LY
Lyte AIPackaging and Assembly lead
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Before you apply
Salary$100k – $200k
LocationSunnyvale, CA
Typefull-time
SeniorityLead
Experience8+ yrs
DepartmentOperations
EquityIncluded
Company size201–500 people
First seenOct 16, 2026 · 3w ago
Verified live1d ago
At a glanceSummarised by Seekless from the posting.
Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience
Experience with process integration for process flow design and continue process improvement
Former experience of microelectronic and optical devices packaging is a must
Project management capability/experience is a must
Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement is important
Experience with FMEA, failure analysis, and 8D report
Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must
Fast learner is a must
Good work ethics is a must
Capable of keeping company confidential information and IP is a must
Experience on process flow design, and SPC, particularly the six sigma and Lean manufacture continuing improvement plan, and material staging concept are highly desirable
Familiar with data analysis software such as JMPs is a plus
Knowledge of wafer level process including lithography, thin film, plating, and DIE/DRIE is a plus
Experience with PCBA process is highly desirable
Understanding Silicon Photonics is a plus
Experience in IIIV wafer process, bar level process, and CoC packaging is a plus
Supplier quality management experience is a plus
Knowledge of Lidar and relevant technologies is a plus
Former experience of writing technical SoW is a plus
Familiar with ECN, PCN and documentation are highly desirable
Skills
JMPs
SPC
FMEA
Benefits
Health insurance
Dental
Vision
401(k)
Flexible vacation
About the role
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We are seeking an experienced process lead/Manager in the field of optical sensor device packaging and contract manufacture with a degree in Electrical Engineering, Photonics, Mechanical Engineering, Physics or a related field.Describe the role and team the candidate will be joining
What you’ll do
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Lead NPI process team involving wafer, device packaging, PCBA assembly process improvement and optimization for yield improvement through material selection optimization, process refinement, or specs opening through DOE for corner case studies.
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Communicate with the RnD team to understand the design targets, existing specs, and existing process flow, process maturity, and its related yield for each process step.
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Lead the tradeoff between the design and process.
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Work with our wafer foundries and OSATs to support NPI and volume production contract manufacture.
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Lead process integration check to ensure the upstream process will not affect the downstream process yield.
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Act as the technical program manager for operation process team.
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Provide DFM, DFR, DFT inputs for HQ RnD teams for device tapeout design ad device packaging during the design phase.
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Develop and maintain packaging and component specifications as well as inventory tracking.
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Audit/regularly visit our contract Manufacturers and suppliers then provide reports.
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Write technical reports and present results to internal and external stakeholders.
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Build and grow the Operation Process Team worldwide.
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Write technical SOW.
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Drive Cp, Cpk, and yield improvement.
Required Qualifications
•
Minimal requirement is a Master or Ph.D. degree with 8 years of relevant experience.
•
Experience with process integration for process flow design and continue process improvement.
•
Former experience of microelectronic and optical devices packaging is a must.
•
Project management capability/experience is a must.
•
Experience working with foundries, OSATs, PCBA fab, and contract manufacturers in process development and yield improvement is important.
•
Experience with FMEA, failure analysis, and 8D report.
•
Ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must.
•
Fast learner is a must.
•
Good work ethics is a must
•
Capable of keeping company confidential information and IP is a must.
Preferred Qualifications
•
Experience on process flow design, and SPC, particularly the six sigma and Lean manufacture continuing improvement plan, and material staging concept are highly desirable.
•
Familiar with data analysis software such as JMPs is a plus.
•
Knowledge of wafer level process including lithography, thin film, plating, and DIE/DRIE is a plus.
•
Experience with PCBA process is highly desirable.
•
Understanding Silicon Photonics is a plus.
•
Experience in IIIV wafer process, bar level process, and CoC packaging is a plus.
•
Supplier quality management experience is a plus.
•
Knowledge of Lidar and relevant technologies is a plus.
•
Former experience of writing technical SoW is a plus.
•
Familiar with ECN, PCN and documentation are highly desirable.
Benefits
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Competitive salary and equity
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Comprehensive medical, dental, and vision coverage
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401(k) retirement plan
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Flexible vacation and time-off policy
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Collaborative, fast-paced, and inclusive work environment
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Opportunity to work on cutting-edge technologies with a highly cross-functional team
About the company
About Lyte
Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!