Substrate Process Engineer
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Before you apply
Salary$90k – $140k
LocationGoleta, CA, Goleta, United States
Work modeon-site
Typefull-time
SeniorityMid
Experience3+ yrs
DepartmentProcess Engineering
Company size14+ people
PostedJul 8, 2025 · 1y ago
Verified live3d ago
May no longer be actively hiring
Posted by the company on Jul 8, 202571% of this company's open roles have been listed for 90+ days
At a glanceSummarised by Seekless from the posting.
B.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related)
3+ years experience in semiconductor or MEMS fabrication
Hands-on experience in at least two of the following: Wafer bonding, Wet etching, Electroplating, CMP or wafer thinning, Dicing
Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive)
Wet etch processes (Si, oxide, metals) including rate and uniformity control
Support electroplating processes (Au, Cu, Ni, NiFe, AuSn)
Support Dicing, CMP, wafer Grinding processes
Improve yield, reduce defects, and optimize process stability
Perform DOE, root cause analysis, and SPC monitoring
Support equipment qualification and uptime
Work closely with R&D, production, and quality teams
Skills
Wafer bonding
Wet etching
Electroplating
CMP
Wafer thinning
Dicing
Summary:
About the company
Atomica is a U.S.-based microfabrication foundry that builds advanced platforms for AI hardware, photonics, sensors, MEMS, and biotechnology devices. Atomica supports customers developing AI optical connectivity, AI optical source integration, photonic integration, thermal microstructures, physical AI sensors, MEMS optical control systems, and biotechnology microdevices with rapid prototyping and scalable production.
We are seeking a highly skilled and motivated Substrate Process Engineer with expertise in wafer bonding and high-precision alignment to join our MEMS fabrication team. This role focuses on developing and sustaining critical wafer-level bonding and alignment processes, such as anodic, fusion, direct, and adhesive bonding, with a strong emphasis on sub-micron to micron-level alignment accuracy required for MEMS device integration. The candidate will work closely with process engineering, integration, and R&D teams to enable reliable and scalable backend processes in a cleanroom manufacturing environment.
Key Responsibilities:
•
Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive).
•
Wet etch processes (Si, oxide, metals) including rate and uniformity control.
•
Support electroplating processes (Au, Cu, Ni, NiFe, AuSn).
•
Support Dicing, CMP , wafer Grinding processes.
•
Improve yield, reduce defects, and optimize process stability.
•
Perform DOE, root cause analysis, and SPC monitoring.
•
Support equipment qualification and uptime.
•
Work closely with R&D, production, and quality teams.
Qualifications:
•
B.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related)
•
3+ years experience in semiconductor or MEMS fabrication
•
Hands-on experience in at least two of the following:
•
Wafer bonding
•
Wet etching
•
Electroplating
•
CMP or wafer thinning
•
Dicing
Why work with us?
Atomica is changing the world. Working at Atomica is truly a one-of-a-kind opportunity to impact groundbreaking technology while living in paradise.
Your contributions to our MEMS technology will drive innovation, solve the great problems of our time and directly impact the lives of people across the globe.
Life in Santa Barbara:
Want to live in paradise? Life in Santa Barbara is just that. Atomica is sandwiched between the beautiful Santa Ynez mountains and the pristine Central California coastline. The weather? Absolutely gorgeous. No more shoveling snow or hiding from tornadoes!
Within 5-minutes from the office, you will find rich local culture, world class schools, airport for convenient travel, festivals, and excellent options to wine and dine.
We have had employees move from all over the country and say life has never been better!
Compensation:
$90,000-$140,000
*Atomica encourages applications from candidates at all levels where pay will be based on experience.*