LY
Lyte AIPackaging Design and SI/PI Engineer
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Before you apply
LocationBucharest, Romania; Taiwan; Singapore
Typefull-time
SenioritySenior
Experience5+ yrs
DepartmentSilicon
EquityIncluded
Company size201–500 people
First seenOct 16, 2026 · 2w ago
Verified live21h ago
At a glanceSummarised by Seekless from the posting.
Bachelor's degree in electrical engineering or a related field
5 years of experience
Fluent in English communication
Experience in substrate design and packaging technology
Experience in signal and power integration simulation and interpretation of the results
Experience in EDA tools: Siwave, HFSS, APD, or similar
Maintain company confidential information
Master's degree with more experience
Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
Experience with hands-on testing of electronic packages/systems
Knowledge and experience in device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly
Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS
Data analysis experience such as JMPs or Excel
Programming and software maintenance skills in Python or C++
Skills
Python
C++
Siwave
HFSS
APD
Altium
Allegro PCB
Spectre
Hspice
Sigrity
ADS
JMPs
Benefits
Competitive salary
Equity
Flexible vacation
Flexible time off
Collaborative environment
Inclusive environment
About the role
•
We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field.
What you’ll do
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Own the design and layout of our micro-electronic package, the heart of our LyteCore system
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Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package
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Perform signal/power integrity simulation to optimize our package & system performance
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Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target.
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Project tracking weekly.
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Write technical reports and present results.
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Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope.
Required Qualifications
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Minimal requirement is a bachelor’s degree with 5 years of experience
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Fluent in English communication, able to collaborate with teammates in different time zones
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Experience in substrate design and packaging technology
•
Experience in signal and power integration simulation and interpretation of the results
•
Experience in EDA tools: Siwave, HFSS, APD, or similar
•
Maintain company confidential information are a must
Preferred Qualifications
•
Master’s degree with more experience is highly desired
•
Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
•
Experience with hands-on testing of electronic packages/systems.
•
Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.
•
Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS.
•
Data analysis experience such as JMPs is a plus; excel is OK.
•
Programming and software maintenance skills are desired eg. python, or C++
•
Describe the experience and attributes of the ideal candidate
Benefits
Benefits (subject to location and local regulations)
•
Competitive salary and equity
•
Flexible vacation and time-off policy
•
Collaborative, fast-paced, and inclusive work environment
•
Opportunity to work on cutting-edge technologies with a highly cross-functional team
About the company
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About Lyte
Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!